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PSPI (Photosensitive Polyimide)
for semiconductors is mainly used for DRAM and SYSTEM semiconductors,
and is also used for semiconductor WLP(Wafer Level Packaging).
PSPI used for semiconductor post-processing is used for FI-WLP,
FO-WLP, FC BGA / CSP bumping, redistribution (RDL) and stress buffer layer.
In particular, the photodefinable insulating film (PSPI) for semiconductor post-processing
that directly implements the photo-definable properties
that enable fine patterns is used to prevent damage during post-processing of the formed circuit
and to prevent cracking after chip mounting
As the line width of the semiconductor device is minimized,
the material having a high thickness as an etch mask material
for forming a fine pattern has a high aspect ratio,
resulting in problems such as pattern collapse. For this reason,
a silicon hardmask material is needed
that can sufficiently serve as a mask for the substrate even at low coating thickness.
HUNETPLUS’ Silicon Hardmask material is a Si-O-based material
and is a process material with high etch selectivity and low reflectivity.
